NVIDIA GPU SoC Module Compatibility
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NVIDIA® Jetson AGX Orin module (64GB)
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Networking
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1x GbE RJ-45
1 x M.2 key E 2230 for wifi 6
Optional 2x 10G RJ-45 (via daughter board) (TBD)
Optional 8x PoE (via daughter board) (TBD)
Optional 1x M.2 Key B for 5G connection (via 5G PoE/5G、USB/5G daughter board) (TBD)
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Display Output
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1 x HDMI output 3840 x 2160 at 60Hz
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Temperature
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Operating temperature: -40 to 85°C (carrier board), -20 to 70°C (with fan) (TBD)
Storage temperature -40°C ~ 85°C (TBD)
Relative humidity 40 °C @ 95%, Non-Condensing
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Camera Inputs
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1x 120pin for GMSL camera board
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USB
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1x USB 3.2 Type-C for BSP install
(supports OTG mode,when using with PoE/5G daughter board or USB/5G daughter board ,the USB 3.2 OTG port becomes USB 2.0)
1x USB 3.2 Type-C (host mode only)
Optional 8x USB3.2 Type-A (via daughter board) (TBD)
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Storage
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2x NVMe M.2 Key M 2280 (1x only support S1 Type Top side component SSD)
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TPM
(Trusted Platform Module)
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Built in Infineon SLB 9672 TPM Chip
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Expansion Header
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30pin header: 1xUART, 1xI2C, 3xGPIO,1xSPI, 2xCAN BUS, 1xI2S, 5V(Maximum 0.7A), 3.3V(Maximum 0.7A)
•12pin header: 1x12V(Maximum 0.7A), 1x5V(Maximum 1A), 1x3.3V(Maximum 1A) power Output, 1xUSB 2.0, 1xDMIC
•16pin wafer for OOB or External Button:
-OOB: 1xUART, 1xDebug UART, 1xPower button, 1xReset button,
1x Power detect (via out-of-band management module)
-External Buttons: 1xPower Button, 1xReset button, 1xRecovery button,
1xPWR_LED (via external button cable)
•40pin coaxial connector for 10G expansion
•40pin coaxial connector for PCIe expansion
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GPS |
Optional Dual-RTK GNSS support (via daughter board) |
Sensor |
Temperature sensor for PCB top/bot Temperature measure |
Power requirement |
Mini-Fit 4pin compatible ,12V +/- 5% DC Input |
Thermal Solution |
Fan solution (12V fan wafer) |
RTC Battery |
Support RTC Battery and Battery Life Monitoring by MCU |
PCB/Electronics Mechanical Info |
W: 92mm x L: 107mm (TBD)
•Weight: 1kg (TBD) |
Certifications
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CE, FCC, VCCI,KC
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