| Model | – HBFBU03-6412-B – HBFBU03I-6412-B
 – HBFBU03-6412-T (TPM)
 – HBFBU03I-6412-T (TPM)
 | 
| CPU/Chipset | – Intel® Elkhart Lake SoC Processor (J6412) | 
| BIOS | – AMI Flash ROM | 
| Memory | – 1* DDR4 3200MHz Dual Channel SO-DIMM up to 16GB | 
| Network | – 2* Intel i255V 2.5GbE | 
| Graphics | – Intel® HD Graphics, shared memory – 1* DP (Max Resolution: 4096×2160@60Hz)
 – 2* HDMI 2.0 (Max Resolution: 4096×2160@60Hz)
 – Support Triple Displays
 | 
| Storage | – 1* M.2 M-key (2260/2280, PCIe Gen.3 x2/SATA interface) support NVME | 
| Expansion slot | – 1* M.2 E-key (2230, PCIe Gen.3 x1/USB2.0 interface, used for WLAN device | 
| Rear Panel I/O | – 2* RJ45 – 1* DP
 – 1* DC-in
 – 2* HDMI
 – 1* USB3.1(Gen.2)
 | 
| Front Panel I/O | – 1* Power button + Power LED – 2* USB(TypeC)
 – 1* Audio(Line out+MIC)
 – 1* USB2.0
 – 1* USB3.1(Gen.2)
 | 
| Internal Connector | – 32GB eMMC onboard | 
| Power Source | – Adapter : AC 90~240V input / DC12V_40W output – MB : DC12V input
 | 
| Compliance | – CE, FCC, LVD, RoHS, ErP Ready | 
| Temperature | – Operating Temperature: -20 ~ 60° C (Under the condition of using M.2 interface SSD)
 – Operating Temperature: 0 ~ 50° C
 (Under the condition of using 2.5” SATA HDD)
 (The test environment is closed and windless)
 – Storage Temperature: -20 ~ 60° C
 – Humidity: 10% ~ 90% RH @40°C (non-condensing)
 | 
| Dimensions | – System: 125 (W) x 109.2 (D) x 44.5 (H) mm | 
| OS Support | – Windows 10, Windows 11, Linux |