| Model | – HBFBZ10-6412-B – HBFBZ10I-6412-B
 – HBFBZ10-6412-E (EMMC)
 – HBFBZ10I-6412-E (EMMC)
 – HBFBZ10-6412-T (EMMC&TPM;)
 – HBFBZ10I-6412-T (EMMC&TPM;)
 
 | 
| CPU/Chipset | – Intel® Elkhart Lake SoC Processor (J6412) | 
| BIOS | – AMI Flash ROM | 
| Memory | – 1* DDR4 3200MHz SO-DIMM up to 16GB | 
| Network | – 4* Intel i255V 2.5GbE | 
| Graphics | – Intel® HD Graphics, shared memory – 1* HDMI 2.0 (Max Resolution: 4096×2160@60Hz)
 | 
| Storage | – 1* M.2 M-key (2242, PCIe Gen.3 x2/SATA interface) support NVME, (co-layout M.2 B-key) | 
| Expansion slot | – 1* M.2 E-key (2230, PCIe Gen.3 x1/USB2.0 interface) – 1* M.2 B-key (3042/3052, USB3.1 interface) co-layout M.2 M-key
 (If you use M.2 B-key type-3042/3052 card, M.2 M-key type-2242 is not available; vice versa)
 | 
| Rear Panel I/O | – 4* RJ45 – 1* COM (RJ45 type)
 – 1* DC-in jack
 | 
| Front Panel I/O | – 1* Power button + Power LED – 1* Reset
 – 1* USB3.1
 – 1* USB2.0
 – 1* HDMI (Max. 4096×2160@60Hz resolution)
 | 
| Internal Connector | – 32GB eMMC onboard (by model) – 1* SIM card holder
 | 
| Compliance | – CE, FCC, RoHS, ErP Ready | 
| Power Source | – MB : DC12V input – Adapter : AC 90~240V input / DC12V-3.3A-40W output
 | 
| Compliance | – CE, FCC, LVD, RoHS, ErP Ready | 
| Temperature | – Operating Temperature: -20 ~ 60° C (Under the condition of using M.2 interface SSD) – Storage Temperature: -20 ~ 80° C
 – Humidity: Between 40% and 60%, non-condensing
 | 
| Dimensions | – System: 125 (W) x 109 (D) x 39.5 (H) mm | 
| OS Support | – Windows 10, Windows 11, Linux |